DEK Electroform solutions
Ultimate deposition control for demanding applications
Using an additive production process, DEK Electroform solutions ensure extreme stencil thickness control for deposit uniformity across multiple applications including standard SMT, micro-SMD, semiconductor, solar and LED lighting. This stencil technology allows printing of very complex designs, into cavities and multiple levels, and around components. With its center of competence in Singapore, ASM develops new manufacturing processes such as electroplating solutions for stencils.
- Excellent uniformity and control
- High throughput alternative to dispensing or spray coating for certain applications
- High-yield results
- No additional costs for large quantities of apertures
- No deformation of stencil like lasering of large quantities of apertures like for wafer bumping
- Test and development support for new projects
- Adaptable for multiple applications
Interested? Call our electroform stencil experts to discuss your specific application.