ASM Standard substrate carrier

Maximum support for flexible, odd-shaped or delicate substrates

Electronics miniaturization driven by mobile electronics, wearables, high-density connectors and LED strips require printing onto flexible PCBs, small boards and odd-shaped substrates. These applications need fixed pallets for robust transport through the SMT process.

• Consistent flatness, stable printing, process control
• Pallet size: 400 mm x 400 mm
• Wafer diameters: 4/5/6/8/12 inches (100 mm to 300 mm)
• Wafer thickness: 150 µm to 600 µm
• The wafer is vacuum-secured during transport; automatic and manual operation
• Custom solutions available
• Data formats: Gerber, DXF, DWG
• Material: Durastone, aluminum and sintered stainless steel

For more info click on the links below.