ASM Standard substrate carrier
Maximum support for flexible, odd-shaped or delicate substrates
Electronics miniaturization driven by mobile electronics, wearables, high-density connectors and LED strips require printing onto flexible PCBs, small boards and odd-shaped substrates. These applications need fixed pallets for robust transport through the SMT process.
- Consistent flatness, stable printing, process control
- Pallet size: 400 mm x 400 mm
- Wafer diameters: 4/5/6/8/12 inches (100 mm to 300 mm)
- Wafer thickness: 150 µm to 600 µm
- The wafer is vacuum-secured during transport; automatic and manual operation
- Custom solutions available
- Data formats: Gerber, DXF, DWG
- Material: Durastone, aluminum and sintered stainless steel
For more info click on the links below.